The use of POCT devices with virus receptors for COVID-19 detection is becoming more popular.
Even though the COVID-19 epidemic has lessened in many parts of the world, countries like Spain, Saudi Arabia, the United Kingdom, and Germany remain under the pandemic’s grip. Companies in the photonic integrated circuits (PIC) market are seizing this opportunity to create point-of-care diagnostic devices that allow for the rapid and accurate identification of whether a patient is infected utilising virus receptors.
Business activities are being impacted by common business difficulties such as disruptions in raw material supply and variable demand. In comparison to the healthcare, aviation, and hotel industries, the photonic integrated circuits (PIC) market and semiconductor industry are far from witnessing the severe repercussions of the coronavirus outbreak. Many businesses appear to have adequate inventory levels and are using the plug-and-play method to manage production.
In quantum chip applications, hybrid platforms are gaining traction.
Companies in the photonic integrated circuits (PIC) market are unlocking income prospects in hybrid integrations, in addition to monolithic and module integration. In most quantum applications, monolithic photonic platforms are necessary to meet severe standards. To circumvent the limitations of monolithic photonic circuits, firms are developing hybrid platforms that mix several photonic technologies into a single functional unit.
During the forecast period, the market for photonic integrated circuits (PIC) is expected to grow at a staggering CAGR of 23%. This is clear since quantum chip developments are being scaled up. Engineers at MIT have gained notoriety for developing a hybrid approach that combines photonics with artificial atoms to produce one of the world’s largest quantum chips.
The Report’s Scope
This research report divides the global PIC market into three categories: integration, raw materials, and applications. It also includes revenue forecasts from 2012 to 2022, as well as future PIC applications. It explains how PIC technology is being used in different parts of the world. The research examines the PIC market’s application mapping in terms of its growth potential and user acceptance.
Integration as a foundation
Module, hybrid, and monolithic PICs make up the global PIC market in terms of integration. The market for PICs based on various integration approaches in North America, Europe, Asia-Pacific, and the Rest of the World is covered in this study.
Using Raw Materials as a Base
Lithium Niobate, Silica on Silicon, Silicon on Insulator, Indium Phosphide, and allium Arsenide are some of the raw materials utilised to make PICs.
Using application areas as a criterion
Optical Fiber communication, optical fibre sensors, biomedical, and quantum computing are some of the applications of Photonic Integrated Circuits. The current state of the market for various applications is discussed.
Geographical considerations
North America, Europe, Asia-Pacific, and the Rest of the World are all included in the geographical study.
PIC (photonic integrated circuit) is a cutting-edge technology that simplifies optical system design, decreases size and power consumption, and enhances reliability. The notion of a photonic integrated circuit is quite similar to that of an electronic integrated circuit. With the emergence of smaller, less expensive optical interconnects, it is on the cutting edge of computing, with applications ranging from communications and security to medical and entertainment.
The most common application of photonic integrated circuits is optical fibre communication. The vast amounts of data generated by bandwidth-intensive multimedia material, as well as the expanding number of users, necessitate a network that can sustain gigabit transfer speeds. The market for optical fibre communication is being driven by the desire for high-speed communication. Photonic integrated circuits are also employed in optical sensors. The sensing photonic integrated circuit is driven by fibre or free space, allowing it to be used in applications that need wireless operation, such as wind turbines, aeroplane propellers, or helicopter rotor blades. Receivers and transmitters developed specifically for free-space optical communication are used in such applications. Photonic integrated circuits are also being used in biomedicine to analyse opaque skin tissue for diagnostic purposes.
Demand for Photonic Integrated Circuits will gain greatly as a result of this scenario (PICs). PIC adoption rates will rise as demand for fiber-optic communication infrastructure grows. Photonic integrated circuits (PICs) process and distribute data using photons rather than electrons. PICs, which are made of indium phosphide rather than silicon, will be the future of multiplexing and demultiplexing WDM carrier signals. The capacity of PICs to re-amplify optical signals travelling across long distance fibre optic connections makes them valuable.
Optical linkages offer an alternative to the otherwise extensive network of copper interconnections that will be required as the globe moves closer to exascale computing. The Photonic Integrated Circuit (PIC) combines numerous photonic functions and is thus more suited to exascale processing. Despite their density, electronic integrated circuits can never equal the speed of PICs. PICs have a larger bandwidth, are more resistant to electromagnetic interference, and are compatible with today’s CMOS production techniques.
